Our Process

Denkai America copper foils are electroplated on revolving titanium drums, unique for the ability to deposit copper foils with a high-quality surface. Rolls of the plated foils are then subjected to a variety of surface treating operations specially designed for a wide range of end-use requirements. During treating, copper dendrites are deposited onto the foil surface to enhance bonding to various resins systems during lamination. A “barrier-layer” is deposited for promoting reliability in thermal applications, specific proprietary organic layers are applied to promote chemical adhesion, and foils are stain-proofed to prevent oxidation in shipping, storage, lamination, and subsequent customer processing.