Our Process

Denkai America copper foils are electroplated on revolving titanium drums, unique for the ability to deposit copper foils with a high-quality surface. Rolls of the plated foils are then subjected to a variety of surface treating operations specially designed for a wide range of end-use requirements. During treating, copper dendrites are deposited onto the foil surface to enhance bonding to various resins systems during lamination. A “barrier-layer” is deposited for promoting reliability in thermal applications, specific proprietary organic layers are applied to promote chemical adhesion, and foils are stain-proofed to prevent oxidation in shipping, storage, lamination, and subsequent customer processing.

Printed Electronics

Copper Clad Laminates (CCL), Printed Circuit Boards (PCB), Flexible Printed Circuits (FPC) and outer-layer copper

Energy/Storage

Lithium Ion Battery (LiB) anode current collectors

Industrial/Shielding

EMI & RF Shielding and thermally conductive applications

Experience Innovation

 Denkai America delivers both conventional cladding and application specific copper foils required by technology leading companies.

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