Product Information

Denkai America is a leader in the manufacture of high-quality electrodeposited copper foils for printed circuit board (PCB), industrial, and energy storage applications. With the strength of domestic manufacturing, and backed by a global presence, Denkai America delivers both conventional cladding and application specific copper foils required by technology leading companies.

Our Process

Denkai America copper foils are electroplated on revolving titanium drums, unique for the ability to deposit copper foils with a high-quality surface. Rolls of the plated foils are then subjected to a variety of surface treating operations specially designed for a wide range of end-use requirements. During treating, copper dendrites are deposited onto the foil surface to enhance bonding to various resins systems during lamination. A “barrier-layer” is deposited for promoting reliability in thermal applications, specific proprietary organic layers are applied to promote chemical adhesion, and foils are stain-proofed to prevent oxidation in shipping, storage, lamination, and subsequent customer processing.

Printed Electronics

Copper Clad Laminates (CCL), Printed Circuit Boards (PCB), Flexible Printed Circuits (FPC) and outer-layer copper


EMI & RF Shielding and thermally conductive applications


Lithium Ion Battery (LiB) anode current collectors

Contact us for information regarding our ED Copper Foils!